micrope.com

Custom Wafer Dicing Services MPE, Inc. takes pride in being a detail-oriented and innovative wafer dicing service provider. The wafer dicing services we provide are also known as wafer cutting, die singulation, mechanical dicing, or mechanical sawing. We are committed to providing superior customer service, while utilizing advanced technology and processes. This allows us to decrease the costs to our customers and increase the quality of their product. Each wafer will be diced with specially customized parameters to minimize yield loss. We utilize Loadpoint dicing saws, which have Windows based operating systems, allowing us to easily use techniques such as multi-pass cuts, ramp up table/ feed rates, and plunge cuts. We also keep in stock a variety of blade types, which allow us to process different materials and thicknesses while maintaining cut quality. We can accept orders ranging from a single wafer or substrate to hundreds of wafers per month. We have experience working with virtually every type of material in the industry including alumina, AlN, GaN (gallium nitride), fused silica, glass, quartz, germanium, SiC, lexan, Lithium niobate (LiNbO3), SOI, Silicon-Germanium (SiGe), and silicon wafers. We have high pressure wash stations that allow us to effectively clean wafers after the dicing process. We also utilize multiple tape vendors to meet our customers’ specifications, and our UV exposure capability allows us to cure tape prior to shipping. We also have processes in place to help with staining and undesirable metal plating caused by galvanic erosion or corrosion.
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Category
computers_electronics_and_technology/consumer_electronics
Monetization
Unknown
Domain Information
Site Overview
Site Engagments
48.20%
Bounce Rate
Pages Per Visit
2
Total Visits
1.6K
Time on Site
00:01:12
Traffic Sources
Social
11.08%
Paid
1.14%
Mail
0.08%
Referrals
5.05%
Search
61.80%
Direct
20.84%
Traffic Top 5 Country
100.00%
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